{"id":"2026-oct-tech-gf-tsmc-silicon-interposers-20261008","canonicalSlug":"2026-oct-tech-gf-tsmc-silicon-interposers-20261008","url":"https://wellficent.com/en/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","language":"en","title":"GF and TSMC set five-year plan for US silicon interposer supply","summary":"The $2 billion agreement points to planned production in Malta, New York, from 2028.","body":["GlobalFoundries (GF) and TSMC announced a manufacturing agreement on 8 October 2026 for a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced-packaging ecosystem. GF values the multi-year agreement at $2 billion, with an initial five-year term.","Production is planned at GF’s Malta, New York facility. Silicon interposers connect multiple dies in advanced packages; GF says it will add fabrication capacity, including support for embedded deep-trench capacitor components. The companies link the project to high-performance computing and AI demand.","This is a plan, not current output. GF expects volume production to ramp in the first half of 2028. The release gives no wafer starts, shipments, capacity, utilization or unit price; $2 billion is the agreement value, not a raw-silicon purchase.","The project would add a planned U.S. source to TSMC’s packaging ecosystem, subject to capacity expansion and qualification. Mubadala identifies an investment in GF, connecting it to an Abu Dhabi investor; the physical manufacturing project is in New York."],"keyPoints":["The manufacturing agreement has a stated $2 billion value and an initial five-year term.","GF plans to make silicon interposers at its Malta, New York site for TSMC’s CoWoS packaging ecosystem.","Volume production is expected to ramp in the first half of 2028; no capacity figure was announced."],"sections":[],"text":"GF and TSMC set five-year plan for US silicon interposer supply\n\nThe $2 billion agreement points to planned production in Malta, New York, from 2028.\n\nThe manufacturing agreement has a stated $2 billion value and an initial five-year term.\n\nGF plans to make silicon interposers at its Malta, New York site for TSMC’s CoWoS packaging ecosystem.\n\nVolume production is expected to ramp in the first half of 2028; no capacity figure was announced.\n\nGlobalFoundries (GF) and TSMC announced a manufacturing agreement on 8 October 2026 for a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced-packaging ecosystem. GF values the multi-year agreement at $2 billion, with an initial five-year term.\n\nProduction is planned at GF’s Malta, New York facility. Silicon interposers connect multiple dies in advanced packages; GF says it will add fabrication capacity, including support for embedded deep-trench capacitor components. The companies link the project to high-performance computing and AI demand.\n\nThis is a plan, not current output. GF expects volume production to ramp in the first half of 2028. The release gives no wafer starts, shipments, capacity, utilization or unit price; $2 billion is the agreement value, not a raw-silicon purchase.\n\nThe project would add a planned U.S. source to TSMC’s packaging ecosystem, subject to capacity expansion and qualification. Mubadala identifies an investment in GF, connecting it to an Abu Dhabi investor; the physical manufacturing project is in New York.","category":"business","region":"world","topics":["semiconductors","chip-materials","ai"],"eventDate":"2026-10-08","eventDateBasis":"source-announcement-publication","publishedAt":"2026-10-09T21:52:15Z","modifiedAt":"2026-10-09T21:52:15Z","publicationBasis":"first-publication","preparedAt":null,"sourcePublishedAt":"2026-10-08","translatedAt":null,"sources":[{"attribution":"GlobalFoundries and TSMC. GF is identified in Mubadala’s portfolio as its investment; production is planned for Malta, New York, not the UAE.","checkedAt":"2026-10-09","licence":"GlobalFoundries terms allow personal/informational use but restrict redistribution and public/commercial use of copied materials. Independently written factual reporting; no source text, image or table reused.","licenseUrl":"https://gf.com/de/terms-conditions/","name":"GlobalFoundries; TSMC","publishedAt":"2026-10-08","url":"https://gf.com/news-and-events/news/globalfoundries-reaches-agreement-to-establish-us-based-supply-of-silicon-interposers-for-advanced-ai-packaging/"},{"attribution":"Mubadala identifies its investment in GlobalFoundries; no republication licence identified. Used only to describe investor location; facts paraphrased.","checkedAt":"2026-10-09","name":"Mubadala Investment Company — Private Equity portfolio","url":"https://www.mubadala.com/en/what-we-do/private-equity"}],"translations":{"en":"https://wellficent.com/en/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","tr":"https://wellficent.com/tr/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","ar":"https://wellficent.com/ar/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","fr":"https://wellficent.com/fr/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","es":"https://wellficent.com/es/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","ru":"https://wellficent.com/ru/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008","pt":"https://wellficent.com/pt/news/2026-oct-tech-gf-tsmc-silicon-interposers-20261008"},"corrections":[],"locations":[],"type":"news","classification":{"dataKinds":["contract-award","project-update"],"evidenceBasis":["agreement","plan"],"geographies":[{"countryCode":"US","role":"event-location","subdivisionCode":null},{"countryCode":"AE","role":"investor-location","subdivisionCode":"AE-AZ"}],"measurementPeriod":null,"version":"1"}}