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GlobalFoundries (GF) marked the SPRINT expansion topping-out in Dresden on 9 October 2026 and announced a roadmap for its FDX Fusion platform. GF says the €1.1 billion project is progressing on schedule; topping-out does not mean added capacity is operating.
GF targets more than one million 300mm wafers of annual Dresden capacity by end-2028. It also plans FDX Fusion, a fully depleted silicon-on-insulator technology for efficient processing, sensing, control and connectivity in Physical AI applications.
The first generation targets 7nm-class digital performance with analog, mixed-signal, embedded-memory and RF capabilities. The roadmap lists demonstrators in early 2027, a process design kit around mid-2027 and manufacturing in 2028; these are targets, not measured results.
Development start depends on German approval under the IPCEI Advanced Semiconductor Technologies programme. Mubadala lists an investment in GF, linking it to Abu Dhabi; the construction and planned manufacturing are in Dresden. The same-day construction and platform releases are treated as one event.