GF and TSMC set five-year plan for US silicon interposer supply

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GlobalFoundries (GF) and TSMC announced a manufacturing agreement on 8 October 2026 for a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced-packaging ecosystem. GF values the multi-year agreement at $2 billion, with an initial five-year term.

Production is planned at GF’s Malta, New York facility. Silicon interposers connect multiple dies in advanced packages; GF says it will add fabrication capacity, including support for embedded deep-trench capacitor components. The companies link the project to high-performance computing and AI demand.

This is a plan, not current output. GF expects volume production to ramp in the first half of 2028. The release gives no wafer starts, shipments, capacity, utilization or unit price; $2 billion is the agreement value, not a raw-silicon purchase.

The project would add a planned U.S. source to TSMC’s packaging ecosystem, subject to capacity expansion and qualification. Mubadala identifies an investment in GF, connecting it to an Abu Dhabi investor; the physical manufacturing project is in New York.